| Method | Max Panel Thick | Min Component Clearance | Stress Level | Suitable For | |--------|----------------|------------------------|--------------|---------------| | | 1.2 mm | 5 mm from score | High | Prototypes, cheap parts | | Pneumatic press | 1.6 mm | 3 mm | Medium | Simple breakaway | | Shear depanelizer | 2.0 mm | 2 mm | Low | Ceramic caps, MLCCs | | Routing depanelizer | 3.2 mm | 1 mm | Very low | Any component, high reliability | | Laser depanelizer | 1.6 mm | 0.5 mm | None | Flex, thin rigid, sensitive sensors |
→ Manual snapping, pneumatic press → Required: Automatic routing depanelizer or laser
Here are some key aspects and benefits of multi-board assemblies:
Multi Board Assembly
| Method | Max Panel Thick | Min Component Clearance | Stress Level | Suitable For | |--------|----------------|------------------------|--------------|---------------| | | 1.2 mm | 5 mm from score | High | Prototypes, cheap parts | | Pneumatic press | 1.6 mm | 3 mm | Medium | Simple breakaway | | Shear depanelizer | 2.0 mm | 2 mm | Low | Ceramic caps, MLCCs | | Routing depanelizer | 3.2 mm | 1 mm | Very low | Any component, high reliability | | Laser depanelizer | 1.6 mm | 0.5 mm | None | Flex, thin rigid, sensitive sensors |
→ Manual snapping, pneumatic press → Required: Automatic routing depanelizer or laser multi board assembly
Here are some key aspects and benefits of multi-board assemblies: | Method | Max Panel Thick | Min
